http://www.ieee-icta.cn/

2018 IEEE International Conference on
Integrated Circuits, Technologies and Applications

The first IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA2018), conference code #44889, will be held November 21-23, 2018 in Beijing, China. This new conference will be held annually in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society. This year’s theme is “Sensors, Integrated Circuits and Systems for IoT and 5G”. ICTA2018 welcomes papers of new and innovative discoveries and designs on

Topics include, but are not limited to, the following technical areas:

 

1.     Building Blocks for RFIC and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, etc.

2.     Analog and Mixed-Signal ICs: power management device and system, OPA, LDO, VGA, amplifier, comparator, filter, AGC, ADC, DAC, divider/multiplier, etc.

3.     Digital ICs: Open code processor, ASIC, FPGA, deep-learning processor, AI in Si, transistor-based DSP, etc.

4.     Modeling, CAD and Testing: Compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, NOC, test structures design and model parameter extraction, RF calibration and reliable data acquisi­tion, CAD, EM/TCAD simulation, co-simulation and verification technique, PDK validation.

5.     Semiconductor Process and Device Technologies: CMOS, FinFET, UT-SOI, LDMOS, HEMT, HBT, SiGe, GaAs, InP, GaN, 2D materials, 3G materials, MEMS, device characterization, simulation and FAR, etc.

6.     Memory Device and Process：memory, flash, OTP, MTP, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.

7.     Emerging Device Technologies: 2D materials, green and implantable materials, neuromorphic device, optoelectronic device, device characterization, etc.

8.     Packaging and Module Technologies: MCM, SiP, SoP, TSV, flip -chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, etc.

9.     Passive ICs and Active Antennas: filters, EM-intensive circuit towards integration in Si-based or compound-semiconductor-based technology, integrated antenna towards massive-MIMO and co-shape design with ICs, on-chip antenna, AIP, integrated passive device, advanced computational EM, etc.

10.  ICs for 5G and Beyond: integrated circuit/system operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) frequencies, digital beam-steering technique, frequency-generation IC, etc.

11.  ICs for Automotive Electronics: high-voltage IC, IVI, ADAS, OBD, AI interface, ACC, automotive radar, etc.

12.  ICs for High-Speed Connectivity: High-speed data link wireless/wireline/optical transceiver, SerDes, CDRs for high-speed data link, opto-electronic IC, etc.

13.  Sensors, Imagers & ICs for Bio-Medical Applications: Low-power IC, WBAN, wearable device and system, security, biomedical and healthcare application, sensor node, RFID, NFC, ZigBee, WPAN, etc.

14.  Sensors and ICs for IoT & 5G Applications: portable device & system, AI system, etc.

Paper submission and deadlines:

To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting an extended abstract, the authors promise that, if accepted, at least one of them will attend ICTA2018 with full registration.

Manuscript submission deadline:           August 8, 2018 (Wednesday)

Notification of acceptance:                           September 16, 2018 (Sunday)

Submission of final extended abstract:   October 21, 2018 (Sunday)

    Upload online to:                                       http://www.epapers.org/icta2018