授课教师：孙宏江博士，武汉新芯集成电路制造有限公司副总经理，技术总监，原Philips半导体公司技术部高级成员。

博士个人简介

Hongjiang Sun, Ph. D

• Directed R&D project and technology management. Prioritized project goals and deliverables. Responsible in budget, plan, milestone and cost/benefit decision-making of projects.

• Built and managed a number of multi-disciplinary/international teamsfor technical and non technical projects. Prioritized project goals and deliverables according to company strategy. Responsible in budget, plan, milestone and cost /benefit decision-making of projects. Interfacedwith equipment, management and manufacturing.

• Managed BEOL team of Advanced Technology Development. Served as a resource to upper management in mediation and resolution of complex problems or leading projects. Worked with various groups outside the immediate area such as testing, failure analysis, reliability, modules engineering, manufacturing operations, and research organizations to facilitate and achieve program success. Responsible for driving integration of advanced modules to meet performance, reliability, yield, and cost objectives.

• Led technology and process transfers among production fabs. Responsibility included working with receiving fabs, package/test, and business units. Assured the quality of transferred products in meeting yield and reliability requirements. Designed transfer plan to ensure successful qualification of technology transfer and yield ramp. Installed process baseline flows from mother fab to receiving fabs.

• Managed Chemical-Mechanical-Polishing (CMP) manufacture operation. Planned and executed CMP project. Responsible in driving tool selection and process validation and building up the CMP operation team as well as creating and executing a staffing and training plan for section managers, engineers, and technicians. Integrated CMP, post-CMP clean and metrology operations into production. Worked with manufacturing engineering, integration, and tool vendors to ensure successful qualification of processes and on-time delivery.

• Directed and led company pilot line project. Contributed to project strategy and roadmap. Prioritized project goals and budget plan. Visited and interacted with equipment and supply vendors. Organized technical assessment in tool and metrology selection. Involved in contract/Vendor Negotiation and start up.

• Mastery of principles and working knowledge of BEOL processes and equipment. Designed, executed, and analyzed experiments to screen and optimize BEOL processes and equipment to meet technology and manufacturing targets. Developed and integrated BEOL modules in CMOS/BiCMOS technologies. Working experience in relevant processing (plasma etching, lithography, thin film, CMP, metallization, interconnect...).

• Yield improvement in advanced CMOS and BiCMOS products. This included manufacture optimization (using DOE, SPC, FMEA…), design improvement, and interaction with engineering and equipment. Monitored and evaluated parametric test (PCM, Cpk…), in-line unit process, and in line defect inspection results using physical and electrical analysis.

• Organized and conducted research and development in high efficiency and low cost BEOL passive devices (high-k MIM capacitor, thin film resistor, and high-Q inductor). Fully responsible in module design, process development and integration, device characterization, module optimization for manufacturability. Transferred knowledge and process to Europe andAsiaproduction fabs.

• Organized and conducted development in BEOL thin film deposition. This resulted in numerous publications and patents as well as production deposition baselines (PVD and MOCVD) and market expansion of existing technology. Responsibilities included planning and executing project and transition from development to manufacture.

• Conducted development in High Density Plasma etching. This included chemistry characterization of plasma etching with a variety of metrology techniques (XPS, SEM, Ellipsometry, FTIR, TEM…) and delivery of production recipes. Set up and optimized the manufacture recipes with innovative process chemistry. Sustained and optimized plasma etching in throughput, selectivity, and profile.

• Developed dielectric and metal CMP. Responsible in driving tool selection and process validation. Qualified high efficiency consumables used in dielectric and metal CMP. Used DOE to develop high throughput production baseline.

EDUCATION

n Ph.D in Physics 1993,Lehigh University,PA,USA

n MS in Physics 1988,Lehigh University,PA,USA

n BS in Physics 1982, Huazhong University of Science and Technology (华中科技大学), Wuhan, PRC.

PUBLICATIONS

Authored and co-authored over 15 patents, papers, and presentations in recent years.